The latest from Esko will be at ALL4PACK EMBALLAGE PARIS!
Visitors to the show will be able to discover Esko’s latest innovations in automation and platemaking
Esko, a global provider of software and hardware solutions that accelerate the time-to-market for packaged goods, will be at ALLPACK EMBALLAGE PARIS this year to showcase its latest innovations.
The Esko S2 platform
The first new feature is Esko S2, the new cloud-native platform that responds to a technological reality based on cloud computing, data sharing and artificial intelligence (AI). ‘ At ALL4PACK, we are taking our customers on a journey into the future of cloud-based connected operations. We are showcasing this platform in Paris with new tools already available to our customers, who can seamlessly integrate their on-premise Esko applications with the S2 platform. This next-generation solution will enable brands and their packaging supply chains to achieve new levels of speed and efficiency to market, representing a quantum leap in integrated and connected workflows,’ said Jan De Roeck, Esko’s Director of Marketing, Industry Relations and Strategy.
The AVT inspection module
ALLPACK EMBALLAGE PARIS will also give Esko the opportunity to present Automation Engine SaaS, a tool for automating workflows across different printing techniques (digital, flexography, offset, etc.). The company will also present its latest hardware innovations such as the AVT varnish inspection module. “The revolutionary AVT print inspection module enables label converters to inspect and detect varnish defects during live label printing. As an extension to the Helios system, the Varnish Inspection Module enables varnish and coating on a variety of printed substrates to be viewed and inspected simultaneously with print inspection. This unique patented module detects problems such as varnish misregistration, partial and total starvation simultaneously with existing print defect detection, enabling label converters to achieve maximum yield while reducing waste in their print production process,’ explains Jan De Roeck.
CDI Crystal XPS ‘Quartz Edition
Also new from Esko at ALL4PACK EMBALLAGE PARIS is the CDI Crystal XPS ‘Quartz Edition’, a high-end addition to the CDI Crystal XPS family of platemaking and display solutions. ‘ A true pinnacle of flexo platemaking, the Quartz Edition combines the enhanced optics of the CDI Crystal with optimised Crystal screens, introducing 2000 lpi surface structures (Q-Cells). Offering a new leap forward in flexo plate imaging speed and print quality, it combines the enhanced optics of the CDI Crystal with Crystal Screening software, optimising final print quality and offering a real alternative to gravure,’ sums up Jan De Roeck.
For more news, click here
You Might Also Like:
ALL4PACK ALL4PACK Emballage Paris ALL4Pack Emballage Paris 2022 ALL4PACK Innovation ALL4PACk innovations all4pack Packaging Paris Beverages bottles cardboard circular economy Citeo Conferences conferences space consummer goods CSR durability eco conception eco responsable eco responsible emballage environment environmentally friendly food safety food security innovation KHS logistic logistics machines materials news packaging paper pharmaceutical plastic printing processing recycling reuse security sustainability sustainable development sustainable packaging sustainable solutions Traceability